Product introduction
Short for Quad Flat no-lead Package; Short for Dual Flat No-Lead, bilateral Flat pin less package, DFN is designed and applied similarly to QFN. The main difference between DFN and QFN is that the pins only line up on either side of the underside of the product rather than around

Product features
Suitable for surface mount packages, halogen-free packages with multiple electrode contacts and a chip pad for mechanical and thermal integrity exposure. The pin less pad design allows it to occupy a smaller PCB area. Considering cost and volume, QFN and DFN package will be a growth area in the coming years, and the prospects are optimistic.

Application
QFN and DFN are considered to be among the most mature industry packaging standards. QFN and DFN are commonly used logic, memory, and microcontrollers. Used in safety chip, automotive electronics, medical equipment electronics, digital video, radio frequency, data acquisition, level converter, frequency converter, universal MCU, car audio processor, lithium battery charging management chip

Process characteristics
Refer to or meet JEDEC standards
Customized design lead frame design and multi-specification pad size to meet different customer needs
Green manufacturing, lead-free process

Reliability test standard
The test criteria is zero defects in 77 sampling units
JEDEC Prerequisite: J-STD-20/JESD22-A113
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature cycle test: -65~150 ℃, JEDEC22-A104
High temperature storage test: 150°C, JEDEC 22-A103
High acceleration stress test: 130°C/85% rh /33.5 PSIA, JEDEC 22-A110/A118